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Á¦¸ñ Plating Thickness µî·ÏÀÏ 19-04-01 13:04
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Á¦Ç°¸í  Plating Thickness 
¸ðµ¨¸í  iEDX-150T 
»çÀÌÁî  650(W) x 820(L) x 600(H)mm  
Ư¡  -. Tube: Mo Target, 50kVp 1mA
-. Detector: Si-Pin, SDD(Option)
-. Resolution(Si-Pin): 149eV at Mn Ka
-. Resolution(SDD): 125eV at Mn Ka
-. Collimator: 0.1, 0.2, 0.3, 0.5, 1mm
-. Detection Ele: AI(13)~U(92) 


-. Tube: Mo Target, 50kVp 1mA
-. Detector: Si-Pin, SDD(Option)
-. Resolution: 149eV at Mn Ka(Si-Pin)
                      125eV at Mn Ka(SDD)
-. Collimator: 0.1, 0.2, 0.3, 0.5, 1mm / Auto Change
-. Detection Element: AI(13)~U(92)
-. Sample Type: Solid / Liguid/ Powder/Multi Layer
-. Chamber Size: 500(W) x 450(L) x 150(H)mm
-. Stage: Auto
-. CCD: x40~80
-. Safety: 3 Point Interlock
 -. Application:
    =. RoHS / WEEE / ELV Compliant
    =. Cr,Br,Cd,Hg,Pb,Cl,Sb,Sn,S
    =. PCB/Connector/Automobile/Capacitor
-. iEDX-150T sp10: Si-Pin/0.3mm/Manual Stage
-. iEDX-150T sp30: Si-Pin/0.2,0.3,0.5,1mm
-. iEDX-150T mp30: SDD
-. iEDX-150T mp40: Plating Thickenss + RoHS/Rh Target

 
 

´ë±¸±¤¿ª½Ã ´Þ¼º±º ¿ÁÆ÷À¾ µ¹¹Ì·Î 48, 3Ãþ, 301È£(´Ù¼Øºôµù) email sgbang@samncom.com Mobile +82-10 2814 2247
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